i ntegrated c ircuits d ivision ds-CPC1909-r08 www.ixysic.com 1 e 3 characteristics features ? 15a rms load current with 5c/w heat sink ? low 0.1 ? on-resistance ? 60v p blocking voltage ? 2500v rms input/output isolation ? low thermal resistance: ? jc = 0.3 c/w ? isolated, low thermal impedance ceramic pad for heat sink applications ? low drive power requirements ? arc-free with no snubbing circuits ? no emi/rfi generation ? machine insertable, wave solderable applications ? industrial controls / motor control ? robotics ? medical equipment?patient/equipment isolation ? instrumentation ? multiplexers ? data acquisition ? electronic switching ? i/o subsystems ? meters (watt-hour, water, gas) ? transportation equipment ? aerospace/defense approvals ? ul 508 certified component: file e69938 pin configuration description ixys integrated circuits division and ixys have combined to bring optomos? technology, reliability and compact size to a new family of high-power solid state relays. as part of this family, the CPC1909 single-pole normally open (1-form-a) solid state power relay is rated for up to 15a rms continuous load current with a 5c/w heat sink. the CPC1909 employs optically coupled mosfet technology to provide 2500v rms of input to output isolation. the optically coupled outputs, that use patented optomos architecture, are controlled by a highly efficient infrared led. the combination of low on-resistance and high load current handling capability makes this relay suitable for a variety of high performance switching applications. the unique isoplus-264 package pioneered by ixys allows solid state relays to achieve the highest load current and power ratings. this package features a unique ixys process where the silicon chips are soft soldered onto the direct copper bond (dcb) substrate instead of the traditional copper leadframe. the dcb ceramic, the same substrate used in high power modules, not only provides 2500v rms isolation but also very low junction-to-case thermal resistance (0.3 c/w). ordering information switching characteristics parameter rating units blocking voltage 60 v p load current, t a =25c: with 5c/w heat sink 15 a rms / a dc no heat sink 6.5 on-resistance (max) 0.1 ? thermal resistance, junction-to-case, ? jc 0.3 c/w part description CPC1909j isoplus-264 package (25 per tube) form-a i f i load 10% 90% t on t off CPC1909 60v single-pole, normally open power relay
i ntegrated c ircuits d ivision r08 www.ixysic.com 2 CPC1909 1 specifications 1.1 absolute maximum ratings @ 25c absolute maximum ratings are stress ratings. stresses in excess of these ratings can cause permanent damage to the device. functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. 1.2 electrical characteristics @ 25c 1 higher load currents possible with proper heat sinking. 2 measurement taken within 1 second of on-time. 3 for applications requiring high temperature operation (t c > 60oc) an led drive current of 20ma is recommended. symbol ratings units blocking voltage 60 v p reverse input voltage 5 v input control current 100 ma peak (10ms) 1 a input power dissipation 150 mw isolation voltage, input to output 2500 v rms operational temperature -40 to +85 c storage temperature -40 to +125 c parameter conditions symbol minimum typical maximum units output characteristics load current 1 peak t ? 10ms i l -- 25 a p continuous no heat sink 6.5 continuous t c =25 c 15 a rms / a dc continuous t c =99 c i l(99) 7.85 on-resistance 2 i f =10ma, i l =1a r on -0.050.1 ? off-state leakage current v l =60v p i leak --1 ? a switching speeds tu r n - o n i f =20ma, v l =10v t on -1525 ms tu r n - o f f t off -0.310 output capacitance v l =25v, f=1mhz c out - 4000 - pf input characteristics input control current to activate 3 i l =1a i f --10 ma input control current to deactivate - i f 0.6 - - ma input voltage drop i f =5ma v f 0.9 1.2 1.4 v reverse input current v r =5v i r --10 ? a input/output characteristics capacitance, input-to-output - c i/o -1- pf
i ntegrated c ircuits d ivision 3 www.ixysic.com r08 CPC1909 2 thermal characteristics 2.1 thermal management device high current characterization was performed using kunze heat sink ku 1-159, phase change thermal interface material ku-alc 5, and transistor clip ku 4-499/1. this combination provided an approximate junction-to-ambient thermal resistance of 12.5c/w. 2.2 heat sink calculation higher load currents are possible by using lower thermal re sistance heat sink combinations. parameter conditions symbol rating units thermal resistance (junction to case) - ? jc 0.3 c/w thermal resistance (junction to ambient) free air ? ja 33 c/w junction temperature (operating) - t j -40 to +100 c t j = j u nction temperatu re (c), t j 100c * t a = amb ient temperature (c) i l(99) = load current w ith case temperature @ 99c (a dc ) i l = desired operating load c urrent (a dc ), i l i l(max) jc = thermal resistance, j unction to case (c/w) = 0.3c/w ca = thermal resistance of heat sink & thermal interface material , case to am bient (c/w) p d(99) = maxim um po w er dissipation w ith case temperature held at 99oc = 3.33w * ele v ated ju nction temperature reduces semicondu ctor lifetime. note: the exposed s u rface of the dcb sub strate is not to be soldered. heat sink rating ca = - jc (t j - t a ) i l(99) 2 i l 2 ? p d(99)
i ntegrated c ircuits d ivision r08 www.ixysic.com 4 CPC1909 3 performance data @ 25c (unless otherwise noted) unless otherwise specified, all performance dat a was acquired without the use of a heat sink. the performance data shown in the graphs above is typical of device performance. for guaranteed parameters not indicated in the written specifications, please contact our application department. 35 30 25 20 15 10 5 0 1.30 1.31 1.32 1.33 1.34 led forward volta g e (v) device count (n) typical led forward volta g e drop (n=50, i f =10ma, i l =1a dc ) 35 30 25 20 15 10 5 0 10.0 12.5 15.0 20.0 17.5 22.5 typical turn-on time (n=50, i f =20ma, i l =1a dc ) turn-on (ms) device count (n) 0.23 0.35 0.47 0.17 0.29 0.41 25 20 15 10 5 0 turn-off (ms) device count (n) typical turn-off time (n=50, i f =20ma, i l =1a dc ) 35 30 25 20 15 10 5 0 0.033 0.037 0.041 0.045 0.049 0.053 on-resistance () typical on-resistance distribution (n=50, i f =10ma, i l =1a dc ) device count (n) led forward volta g e drop (v) typical led forward volta g e drop vs. temperature 1.8 1.6 1.4 1.2 1.0 0.8 -40 -20 0 20 40 60 8 0 120100 temperature (oc) i f =50ma i f =20ma i f =10ma led forward current (ma) 0 5 1015202530354045 120 100 80 60 40 20 0 50 turn-on (ms) typical turn-on time vs. led forward current (i l =1a dc ) led forward current (ma) 0 5 1015202530354045 0.45 0.40 0.35 0.30 0.25 0.20 0.15 0.10 0.05 0.00 50 turn-off (ms) typical turn-off time vs. led forward current (i l =1a dc ) led current (ma) -40 5.0 4.5 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0 -20 0 20 40 60 8 0 100 typical i f for switch operation vs. temperature (i l =1a dc ) temperature (oc) -40 42 36 30 24 18 12 6 0 -20 0 20 40 60 8 0 100 temperature (oc) turn-on (ms) typical turn-on time vs. temperature (i l =1a dc ) i f =10ma i f =20ma -40 0.48 0.42 0.36 0.30 0.24 0.18 0.12 0.06 -20 0 20 40 60 8 0 100 typical turn-off time vs. temperature (i l =1a dc ) temperature (oc) turn-off (ms) i f =20ma i f =10ma
i ntegrated c ircuits d ivision 5 www.ixysic.com r08 CPC1909 unless otherwise specified, all performance dat a was acquired without the use of a heat sink. the performance data shown in the graphs above is typical of device performance. for guaranteed parameters not indicated in the written specifications, please contact our application department. -40 0.060 0.058 0.056 0.054 0.052 0.050 0.048 0.046 0.044 -20 0 20 40 60 8 0 100 on-resistance () typical on-resistance vs. temperature (i f =10ma, i l =1a dc ) temperature (oc) load current (a) -0.54 10 8 6 4 2 0 -2 -4 -6 -8 -10 -0.36 -0.1 8 0.18 0.36 0 0.54 load volta g e (v) typical load current vs. load volta g e (i f =10ma) 0204060 8 0 100 0 5 10 15 20 1oc/w 5oc/w 10oc/w no heat sink temperature (oc) load current (a rms ) maximum load current vs. temperature with heat sink (i f =20ma) -40 84 82 80 78 76 74 72 70 68 -20 0 20 40 60 8 0 100 normalized blockin g volta g e vs. temperature temperature (oc) blockin g volta g e (v p ) -40 0.014 0.012 0.010 0.008 0.006 0.004 0.002 0 -20 0 20 40 60 8 0 100 typical leaka g e vs. temperature measured across pins 1&2 (v l =60v p ) temperature (oc) leaka g e (a) 30 25 20 15 10 5 0 1ms 10s 100s 100ms 10s 10ms 1s 100s time load current (a p ) ener gy rating curve free air, no heat sink
i ntegrated c ircuits d ivision r08 www.ixysic.com 6 CPC1909 4 manufacturing information 4.1 moisture sensitivity all plastic encapsulated semiconductor packages are susc eptible to moisture ingression. ixys integrated circuits division clas sified all of its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, ipc/jedec j-std-020 , in force at the time of product evaluation. we test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. failure to adhere to the warnings or limitations as establ ished by the listed specificati ons could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. this product carries a moisture sensitivity level (msl) rating as shown below, and should be handled according to the requirements of the latest version of the joint industry standard ipc/jedec j-std-033 . 4.2 esd sensitivity this product is esd sensitive , and should be handled according to the industry standard jesd-625 . 4.3 soldering profile this product has a maximum body temperature and time rating as shown below. all other guidelines of j-std-020 must be observed. note: the exposed surface of the dcb substrate is not to be soldered. 4.4 board wash ixys integrated circuits division recommends the use of no-clean flux formulations. however, board washing to remove flux residue is acceptable. since ixys integrated ci rcuits division employs the us e of silicone coating as an optical waveguide in many of its optically isolated produc ts, the use of a short drying bake could be necessary if a wash is used after solder reflow processes. chlorine-bas ed or fluorine-based solvents or fluxes should not be used. cleaning methods that employ ul trasonic energy should not be used. device moisture sensitivity level (msl) rating CPC1909j msl 1 device maximum temperature x time CPC1909j 245c for 30 seconds e 3
i ntegrated c ircuits d ivision 7 www.ixysic.com r08 CPC1909 4.5 mechanical dimensions 26.162 0.254 (1.030 0.010) 19.914 0.254 (0.784 0.010) 20.396 0.50 8 (0.803 0.020) 15.240 0.50 8 (0.600 0.020) 3.810 0.254 (0.150 0.010) 2.362 0.3 81 (0.093 0.015) 0.635 0.076 (0.025 0.003) 2.794 0.127 (0.110 0.005) 5.029 0.127 (0.198 0.005) 1.181 0.076 (0.047 0.003) 1.930 0.3 81 (0.076 0.015) 17.221 0.254 (0.678 0.010) 20.600 0.254 (0.811 0.010) 1.270 typ (0.050 typ) dimensio ns mm (inches) note: metallized external s u rface of dcb s ub strate maintains 2500 v rms isolation to de v ice internal str uctu re and all external pins. dcb sub strate note: not to be soldered for additional information please vi sit our website at: www.ixysic.com ixys integrated circuits division makes no representations or wa rranties with respect to the a ccuracy or completeness of the co ntents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. neither circuit patent licenses nor indemnity ar e expressed or implied. except as set forth in ixys integrated circuits division?s standard terms and condit ions of sale, ixys integrated circuits division assumes no liability whatsoever, a nd disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringem ent of any intellectual property right. the products described in this document are not designed, intended, authorized or warranted for use as components in systems in tended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of ixys integrated circuits division?s product may resul t in direct physical harm, injury, or death to a person or severe property or environmental damage. ixys integrated circuits divisi on reserves the right to discontinue or make changes to its pr oducts at any time without notice. specification: ds-CPC1909-r08 ?copyright 2015, ixys integrated circuits division all rights reserved. printed in usa. 3/9/2015
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